| 摘要 |
PURPOSE:To readily automate the manufacture of a silver solder ring and a lead pin as well as the step of engaging the pin to the ring by securing by bending a silver solder wire of circular section to a rivet-shaped pin by using a silver solder ring formed to be smaller in an inner diameter than the diameter of the leg of the pin, thereby enhancing the working efficiency. CONSTITUTION:When a silver solder ring 4 is engaged with the root 3a of a rivet-shaped pin 3 such as a lead pin or the like for an IC, the ring 4 is formed by bending a silver solder wire of circular section in a ring shape, and the inner diameter or the ring before engaging is formed to be slightly smaller than the diameter of the leg 3a. Since the ring is secured by its rigidity in this manner, the ring is not disengagd, thereby enhancing the working efficiency and readily automating the setting. |
