Apparatus and method for self-aligning chip placement and leveling

摘要

An approach is provided for aligning and leveling a chip package portion. The approach involves filling, at least partially, a reservoir formed between a first sidewall portion having a first slanted surface and a second sidewall portion having a second slanted surface with a fluid. The approach also involves placing a chip package portion into the reservoir. The approach further involves draining the fluid from the reservoir to cause the chip package portion to align with respect to a center of the reservoir. The chip package portion aligns with respect to the center of the reservoir and levels based on a relationship between the chip package portion, an angle of the first slanted surface, an angle of the second slanted surface, and the fluid. The chip package portion is secured in the aligned and leveled state by a molding compound.

主权项

1. A method comprising:
filling, at least partially, a reservoir formed between a first sidewall portion having a first slanted surface and a second sidewall portion having a second slanted surface with a fluid, the first slanted surface facing the second slanted surface; placing a chip package portion into the reservoir; and causing the chip package portion to align with respect to a center of the reservoir based on a relationship between the chip package portion, an angle of the first slanted surface, an angle of the second slanted surface, and the fluid.