| 摘要 |
PURPOSE:To extremely reduce the probability of failures without generating disconnections, poor insulations, etc. to the mechanical stress or heat by a method wherein projections projected out of each terminal part of a semiconductor thin film are provided on a substrate, then partition walls which guide the both sides of the lead wire of each terminal part are respectively formed, and the projections are inserted into through holes of lead wires resulting in soldering of the lead wires. CONSTITUTION:The numeral 10 represents a circular pin formed projection provided by being projected upward on the upper surface of the substrate 7, and located at the middle between the both partition walls 9, 9' which are opposed each other, 11 the cross-shaped semiconductor thin film evaporated in the grooves among respective partition wall bodies 8 on the upper surface of the substrate 7, which is constituted of a thin film of InSb, GaAs, InAs, etc., and the terminal parts 12a-12d are formed at the four end parts of the semiconductor thin film, respectively. Since the lead wire 14 connected to the terminal parts 12a-12d of the semiconductor thin film 11 is guided by being pinched by the both partition walls 9 and 9' at the both sides thereof, and the projection 10 is inserted into the through hole 15 on one end part, it is mechanically fixed firmly on the substrate 7. Since this lead wire 14 is soldered and hardened by epoxy, it can be formed into a structure wherein the lead wire 14 is difficult to move even when external stresses and thermal influences are applied thereon. |
