HEAT FUSIBLE POLYIMIDE FILMS AND PROCESS FOR PRODUCING THE SAME

摘要

A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula with an aromatic diamine into imide, provided on at least one surface of the polyimide film, and a process for producing the film.