| 摘要 |
PURPOSE:To simplify workability on mounting, and to fix a pellet to a base ribbon, a stem. etc. by previously forming a solder material layer to the mount surface of the semiconductor pellet. CONSTITUTION:An Ni layer 12 for ohmic contact and an Au layer 13 are added to the back of a semiconductor substrate 11, and a solder material Pb-Sn layer 14 is formed previously onto the Au layer. The Pb-Sn layer 14 is formed onto the back of a wafer through evaporation or printing in approximately 5mum thickness before the substrate is separated into the pellets. When the semiconductor pellet is fixed to the base ribbon, the stem, etc., the pellet is placed on a mounting section without newly supplying a mounting material from the outside, and mounted by simply applying heat. |
