| 摘要 |
PURPOSE:To prevent the expansion of solder, and to omit the removing work of excessive solder by forming a groove on a chip bonding base. CONSTITUTION:The groove 12 in size slightly wider than a semiconductor chip 2 is formed on the copper base 11, and the chip 2 is bonded in the groove by solder 3. Projecting sections 13a, 13b, 13c are formed to the outer circumference of the groove 12. According to the constitution, when the chip 2 is soldered 3 to the copper base 11, expansion on the base 11 of solder 3 can be limited, the removing work of excessive solder is unnecessitated, and yield on asssembly is improved. |
