| 摘要 |
PURPOSE:To prevent the optical coupling efficiency from being decreased by mounting by a method wherein, after the final processing at high temperature of fiber guide fixation of a lead or an optical fiber to a stem, the backside of the stem is ground to be flattened. CONSTITUTION:A submount 4 with a chip 5 fixed to the upper surface thereof is fixed to a rack 3 of a stem 1 the under surface of which is flattened while a monitor fiber 12 and an optical fiber 8 are respectively inserted into a guide hole 7 on the other side and a fiber guide 9 on the same side to fix the edges of both fibers opposing to the outgoing surface of the chip 5 using an adhesive. Furthermore, the edge of a lead 14 projecting inside a ring-like sealing wall 2 and the upper electrode of the chip 5 are connected with each other by a conductor (wire) 15 comprising strand while a plate-like cap 16 is air-tightly fixed on the upper surface of the ring-like sealing wall 2 by seam welding and then the backside of the stem 1 is ground down to be flattened. The grinding allowance shall be sufficient to grind down the iregularities due to the deformation resulting from high temperature processing such as lead fixing, silver brazing and the like. |
