发明名称 METHOD OF SEALING ELECTRONIC CIRCUIT
摘要 PURPOSE:To improve the reliability by hardening a connection part with a thermosetting resin, after connecting an output wire to a lead wire at a hole part for leading out the output wire. CONSTITUTION:After inner components such as a pressure detecting element part 6, an angular ring 7, a check plate 8, and a printed substrate 9 are loaded in a case 1, and a metallic wire material 13 is soldered to the lead wire 10 for leading out the output, said material 13 and the case 1 are sealed with the thermosetting resin 12. At the part for leading out the lead wire, a rubber bush 14 is provided on the wall surface of the case 1. Further, a recess is provided in the upper surface of the case 1, and resin is cast and hardened after inserting the end part of a lid 15. Thus, a sealed structure having high reliability can be obtained, and the workability improves, since the part for leading out the lead wire and the lid can be sealed at the same time.
申请公布号 JPS59148355(A) 申请公布日期 1984.08.25
申请号 JP19830022022 申请日期 1983.02.15
申请人 MATSUSHITA DENKI SANGYO KK 发明人 IKEDA YOSHIAKI;MATSUMOTO NORIHITO
分类号 G01L9/04;G01L9/00;H01L23/02;H01L23/50;H01L29/84 主分类号 G01L9/04
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