发明名称 FILM FORMING DEVICE
摘要 PURPOSE:To improve covering performance in the stepped part of a base layer and to realize lift-off by disposing guides between wafers and a film material source for generating film particles. CONSTITUTION:The inside of a bell jar 11 is set at a prescribed degree of vacuum and the inside as well as wafers 14 and, for example, Al 15 on an evaporating tray 17 are heated by a heating means 18. Then the particles of the Al 15 scatter toward four ways in the bell-jar 11 with a scattering source 16 as a center. A part of the particles arrives at the surface of the wafers 14 and forms an Al film thereon. Guide cylinders 19 are disposed between the wafers and the source, the Al particles arrive at the wafers 14 only from the perpendicular direction thereof. Therefore if the wafers 14 are moved relatively with the cylinders 19 by operating a wafer supporting part 13, the films deposited with the Al respectively in the perpendicular direction are formed over the entire surface of the wafers 14.
申请公布号 JPS59208068(A) 申请公布日期 1984.11.26
申请号 JP19830082734 申请日期 1983.05.13
申请人 HITACHI SEISAKUSHO KK;HITACHI MAIKURO COMPUTER ENGINEERING KK 发明人 KASAHARA OSAMU;TAKAHASHI SUU
分类号 C23C14/24;C23C14/34;H01L21/203;H01L21/285 主分类号 C23C14/24
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