| 摘要 |
PURPOSE:To improve the humidity resistance of bonding pads with a low cost by covering the surfaces of the bonding pads of a pellet with Sn or an alloy thereof. CONSTITUTION:The semiconductor pellet 3 consisting of Si and etc. is fixed on a tub 2 of a lead frame 1 and bonding pads of the pellet 3 are bonded to inner leads 5 of the lead frame 1 with wires 4 consisting of gold and etc. and these are connected electrically. Also, the pellet 3 and the wires 4 are sealed in a package 6 by resin-molding. The pellet 3 is formed, for example, by forming a chromium layer 10 and a Cu (or Ni) layer 11 on an opened window of a surface protection layer 9 consisting of P-SiO or P-SiN which is formed on an Al wiring 8 on an Si substrate 7 and further forming a layer 12 of Sn or an alloy thereof on said layer 11. The wires 4 are bonded on the Sn layer 12. |
