A METHOD OF BRAZING ADJOINING SURFACES OF ELEMENTS

摘要

Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of Group IB metal to the brazing material to promote formation of the higher melting point beta phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the beta phase of the alloy and to thicken the braze material. An Au preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing materials to add Ni and Au to the melt almost simultaneously.