Semiconductor module

摘要

A semiconductor module includes first and second semiconductor elements connected to pins, respectively; a first pin wiring substrate having first and second metal films bonded to the pin on the upper and lower surfaces; a first DCB substrate having third and fourth metal films on the upper and lower surfaces, the third metal film being bonded to the lower surface of the first semiconductor element; a second DCB substrate having fifth and sixth metal films respectively provided on the lower and upper surfaces, the fifth metal film being bonded to the upper surface of the second semiconductor element; a second pin wiring substrate having seventh and eighth metal films bonded to the pin, on the upper and lower surfaces; a connection member connected to the second and fifth metal films; a first cooler connected to the fourth metal film; and a second cooler connected to the sixth metal film.

主权项

1. A semiconductor module comprising:
a first semiconductor element; a first pin electrically and thermally connected to an upper surface of the first semiconductor element; a first pin wiring substrate including a first pin wiring insulating substrate, a first metal film disposed on a lower surface of the first pin wiring insulating substrate, and a second metal film disposed on an upper surface of the first pin wiring insulating substrate, the first metal film, the second metal film and the first pin being electrically bonded together; a first direct copper bonding substrate including a first ceramic insulating substrate, a third metal film disposed on an upper surface of the first ceramic insulating substrate and bonded to a lower surface of the first semiconductor element, and a fourth metal film disposed on a lower surface of the first ceramic insulating substrate; a second semiconductor element; a second pin electrically and thermally connected to a lower surface of the second semiconductor element; a second direct copper bonding substrate including a second ceramic insulating substrate, a fifth metal film disposed on a lower surface of the second ceramic insulating substrate and bonded to an upper surface of the second semiconductor element, and a sixth metal film disposed on an upper surface of the second ceramic insulating substrate; a second pin wiring substrate including a second pin wiring insulating substrate, a seventh metal film disposed on an upper surface of the second pin wiring insulating substrate, and an eighth metal film disposed on a lower surface of the second pin wiring insulating substrate, the seventh metal film, the eighth metal film and the second pin being electrically bonded together; a connection member having two ends electrically connected to the second metal film and the fifth metal film, respectively; a first cooler thermally connected to the fourth metal film; and a second cooler thermally connected to the sixth metal film.