发明名称 RESIN-MOLDED HYBRID-IC MOUNTING STRUCTURE ENCLOSING PIEZOELECTRIC VIBRATOR
摘要 PURPOSE:To prevent abnormal oscillation due to contact between a piezoelectric vibrator and other metal lead terminals, which are connected to an oscillating circuit, and to make the thickness of a resin molded part (package) thin, by connecting the piezoelectric vibrator to the electric circuit of a hybrid IC, and positioning the vibration in the vertical and horizontal direction with the spring pressures of the metal terminals. CONSTITUTION:A crystal vibrator 4 is electrically connected to an oscillating circuit 1 and two metal terminals for connection to the crystal vibrators 2 and 3 in the oscillating circuit 4. They are simultaneously molded as a unitary body with a transfer molding resin 5. The crystal vibrator 4 is connected to the connecting part of said metal lead terminals 2 and 3 and the oscillating circuit 1. The vibrator 4 is held by a holding junction with a metal lead terminal 6, which does not give electric characteristics to the crystal vibrator and is located at the neighborhood of the crystal vibrator. The mounting position of the entire crystal vibrator is firmly fixed in this structure. Tightening allowance is imparted to the crystal vibrator 4 and the junction part of said metal lead terminal 6 and the crystal vibrator 4, and spring pressure is provided. Thus the junction with the crystal vibrator 4 is made rigid.
申请公布号 JPS62126656(A) 申请公布日期 1987.06.08
申请号 JP19850267849 申请日期 1985.11.28
申请人 MATSUSHIMA KOGYO CO LTD 发明人 NAKATSUKA HIFUMI;ARIGA SATOMI
分类号 H03H9/10;H01L23/26;H01L23/28;H01L23/495;H01L23/50;H03B5/30;H03B5/32;H03H9/02 主分类号 H03H9/10
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