| 摘要 |
PURPOSE:To extend the life of a soft etching agent for copper clad laminates and to eliminate pollution problems in treatment of waste liquid by using a soln. of mineral acids (except hydrochloric acid) and H2O2 added with phenols, and aryl sulfonic acids as said agent. CONSTITUTION:A soft etching agent prepd. by adding >=1 kind compds. selected among phenols and aryl sulfonic acids to a soln. consisting of mineral acids (except hydrochloric acid) and H2O2. Here, the suppression of foaming from the surface of copper by the noneffective decomposition of H2O2, the suppression of the dissolving rate of copper and the roughening of surface are effected by the addition of phenols and aryl sulfonic acids. If copper clad laminates prior to electroless copper plating are dipped in such soft etching agent, the copper surfaces are roughened by the treatment in a short time. Since the stability of the H2O2 is good, the original effect is maintained even if the soln. is left standing during the use and the recovery of copper from the waste liquid is easy. In addition, this agent does not give rise to pollution problems. |
