| 摘要 |
PURPOSE:To prevent the contact of wires without crushing the wires, by performing electric connection of a semiconductor pellet by attaching the wires to a binding pad through an eutectic. CONSTITUTION:A bonding pad 4 comprises a titanium layer 12, which is contacted with an inner wiring layer 10 that is exposed at an opening part, a nickel layer 13 on the layer 12 and a gold layer 14, which is laminated on the layer 13. A tin (Sn) layer 15 is deposited on the surface of the gold layer 14. A wire 5 comprising gold is wire-bonded on the bonding pad 4 through a gold-tin eutectic 16. Therefore, electric connection can be accomplished only by lightly pushing the wire 5. |
