| 摘要 |
<p>According to the method and apparatus of the present invention, a substrate is disposed between a pair of a gaseous material supply electrodes which are grounded and a high frequency power is applied to the substrate as an object of treatment to generate plasma. The gaseous material is fed into this plasma from both of the electrodes and activated. Thus a film is formed on the substrate. Accordingly, a thin film having high corrosion and wear resistance and being solid and compact can be formed easily on the substrate.</p> |
