| 摘要 |
A semiconductor device has an IC circuit (1) which drives two IC circuits (2, 3) via a micro strip line (4) printed on a board (10) and is terminated with an impedance matching resistor of 50 ohms (45). Each receive-side IC (2;3) has a pair of package leads (211, 212; 311,312), of which the outer ends are connected to a transmission line of the drive side (211;311) and to the terminal side (212;312), whilst the inner ends are connected to pads (251,252; 351,352) on a chip (23;33) with bonding wires (241,241; 341,342). Thus a transmission line is formed from the drive-side IC (1) to the terminating resistor (45) without any branch and with perfect impedance matching. |
