| 摘要 |
<p>Method of providing a printed circuit board with a cover coat (19) on a selected areas, and in alignment with the circuit pattern thereon, which method comprises letting a photoresist (13) covering the areas not to be provided with the cover coat, react on blanked exposing the board to light, with an overlayer of another photosensitive material (17) covering the entire board, whereby the reacted portions (18) are rendered soluble, whereas the remaining portions defining the cover coat (19) are not.</p> |
