Manufacturing method for taping electronic component

摘要

A method of manufacturing a tape of finished electronic components in which the components project laterally from the tape and are supported on the tape by long leads of the electronic components. An electronic component set is prepared constituted by a plurality of electronic component bodies, a lead terminal member having an elongated connecting member and a plurality of groups of laterally extending lead terminals spaced at intervals along the connecting member, one group per component body. All but one of the lead terminals in each group are cut at a position to separate the lead terminals other than the one lead terminal from the connecting member. The electrical properties of the electronic bodies are then measured through the respective terminals, and then the one uncut lead terminal is cut to separate semi-finished electronic components. The free ends of the lead terminals of the semi-finished electronic components are attached to the tape, and then only some of the lead terminals of the respective semi-finished electronic components are cut between the tape and the electronic component bodies for forming short lead terminals to produce finished electronic components having some short lead terminals, with the finished electronic components supported along the tape by the remaining lead terminals which, when they are cut to separate the electronic components from the tape, become long lead terminals of the finished electronic components.