| 发明名称 |
COPPER ALLOY COMPOSITION. |
| 摘要 |
<p>A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula AgxCuy (wherein 0.001 </= x </= 0.999, 0.001 </= y </= 0.999 and x + y = 1), 5 to 200 parts by weight of an organic binder, and 0.01 to 100 parts by weight of an additive which serves to remove copper oxides; and a paste for screen printing, an electromagnetic wave shield, a conductive adhesive, a paste for electrodes, and a paste for through holes each prepared from the composition.</p> |
| 申请公布号 |
EP0470262(A1) |
申请公布日期 |
1992.02.12 |
| 申请号 |
EP19910904341 |
申请日期 |
1991.02.22 |
| 申请人 |
ASAHI KASEI KOGYO KABUSHIKI KAISHA |
发明人 |
YOKOYAMA, AKINORI;KATSUMATA, TSUTOMU;NAKAJIMA, HITOSHI |
| 分类号 |
H01B1/02;B22F1/00;C09D5/24;C09J9/00;C09J9/02;C09J11/04;C22C1/04;C22C5/06;C22C5/08;C22C9/00;H01B1/22;H01C7/00;H05K1/09;H05K3/40;H05K9/00 |
主分类号 |
H01B1/02 |
| 代理机构 |
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代理人 |
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