发明名称 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
摘要 A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface of the light-emitting element via an adhesive; and a second light-transmissive member placed on an upper surface of the first light-transmissive member. In a plan view of the light-emitting device, a peripheral edge of a lower surface of the first light-transmissive member is positioned more inward than a peripheral edge of the upper surface of the light-emitting element. The adhesive extends from the upper surface of the light-emitting element to a lower surface of the second light-transmissive member, the adhesive covers a side surface of the first light-transmissive member, and the adhesive is separated from the substrate.
申请公布号 US2016380165(A1) 申请公布日期 2016.12.29
申请号 US201615262891 申请日期 2016.09.12
申请人 NICHIA CORPORATION 发明人 MIYOSHI Tomonori;OZEKI Kenji
分类号 H01L33/54;H01L33/60;H01L33/56;H01L27/15;H01L33/50 主分类号 H01L33/54
代理机构 代理人
主权项 1. A method of manufacturing a light-emitting device, the method comprising: providing a light emitting element; providing a first light-transmissive member, wherein an area of a lower surface of the first light-transmissive member is smaller than an area of an upper surface of the light emitting element; providing a second light-transmissive member; arranging the first light-transmissive member on the upper surface of the light-emitting element via an adhesive such that, in a plan view, a peripheral edge of the lower surface of the first light-transmissive member is positioned inward of a peripheral edge of the upper surface of the light-emitting element; arranging the second light-transmissive member on an upper surface of the first light-transmissive member via the adhesive; and curing the adhesive.
地址 Anan-shi JP