METHOD FOR ESTIMATING STRESS OF ELECTRONIC COMPONENT

摘要

A method for estimating stress of an electronic component. An electronic component including first and second elements and conductive bumps is provided. Each conductive bump has two surfaces connected to the first and second elements respectively. Two adjacent conductive bumps have a pitch therebetween. The conductive bumps includes a first conductive bump and second conductive bumps. A stress value of the first conductive bump related to a testing parameter is calculated. A stress value of each second conductive bump related to the testing parameter is calculated according to a first calculating formula. The first calculating formula is;σ2=LD-2rσ1,;σ2 is the stress of each second conductive bump, L is a beeline distance between each second conductive bump and the first conductive bump, D is an average value of the pitches of the conductive bumps, r is a radius of each surface, and σ1 is the stress value of the first conductive bump.

主权项

1. A method for estimating stress of an electronic component, comprising:
providing an electronic component comprising a first element, a second element and a plurality of conductive bumps, wherein each of the conductive bumps has two opposite surfaces, the two surfaces are respectively connected to the first element and the second element, a pitch is between adjacent two of the conductive bumps, and the conductive bumps comprises a first conductive bump and a plurality of second conductive bumps; calculating a stress value of the first conductive bump related to a testing parameter; and calculating a stress value of each of the second conductive bumps related to the testing parameter according to a first calculating formula, wherein the first calculating formula isσ2=LD-2rσ1,σ2 is the stress value of each of the second conductive bumps, L is a beeline distance between each of the second conductive bumps and the first conductive bump, D is an average of the pitches of the conductive bumps, r is a radius of each of the surfaces, and σ1 is the stress value of the first conductive bump.