发明名称 Temperature control system for semiconductor wafer or substrate
摘要 A temperature control system is used in conjunction with sputtering, CDV, etching, and the like apparatuses for processing a substrate on which semiconductor devices are integrated. This system responds quickly to any change in the temperature of the substrate being processed, by heating or cooling the substrate to an appropriate temperature and maintaining it constant at such temperature. The heating is accomplished by radiant heaters which heat a gas flowing through the apparatus, which in turn transfers heat to the substrate mounted on the apparatus.
申请公布号 US5113929(A) 申请公布日期 1992.05.19
申请号 US19910680939 申请日期 1991.04.05
申请人 ANELVA CORPORATION 发明人 NAKAGAWA, TOSHIYUKI;TAKAHASHI, NOBUYUKI;AKIMOTO, TAKASHI
分类号 H01L21/00;H01L21/683 主分类号 H01L21/00
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