| 摘要 |
<p>PURPOSE:To minimize the pollution of semiconductor wafer by a method wherein a water reservoir is formed on the semiconductor wafer for reducing the cut-off scraps bonded onto the semiconductor wafer. CONSTITUTION:An adhesive sheet 2 bonded onto a semiconductor wafer 1 is fixed to a flat ring 6. Next, after fixing the rear surface of the semiconductor wafer 1 on a wafer adsorption base 7, the flat ring 6 is fixed to the part above the surface of the semiconductor wafer 1. Finally, the semiconductor wafer 1 in such a state is cut off using a cutting-off blade 3.</p> |
