| 摘要 |
An exposure mechanism having a hole pattern for forming a resist pattern to be used in a photolithography process when a semiconductor device is fabricated, the hole pattern including a central light transmitting portion provided on a transparent substrate, through which exposed light can pass, a plurality of slit-shaped light transmitting portions provided around the central light transmitting portion, and a light intercepting portion provided on the transparent substrate for forming the central light transmitting portion and the slit-shaped light transmitting portions. |
