Semiconductor module having projecting cooling fin groups

摘要

A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating conductor unit also providing the necessary mechanical rigidity of the module. The interconnection comprises a layer containing grains, preferably diamond, leaving high electrically insulating and high thermally conductive properties.