| 发明名称 |
MAGNETIC VIAS WITHIN MULTI-LAYER, 3-DIMENSIONAL STRUCTURES/SUBSTRATES |
| 摘要 |
Ferromagnetic structures formed of ferromagnetic via fills in a unitized multilayer microcircuit structure that is formed of a plurality of insulating tape layers. |
| 申请公布号 |
WO9407349(A1) |
申请公布日期 |
1994.03.31 |
| 申请号 |
WO1993US09052 |
申请日期 |
1993.09.24 |
| 申请人 |
HUGHES AIRCRAFT COMPANY |
发明人 |
MCCLANAHAN, ROBERT, F.;WASHBURN, ROBERT, D.;SMITH, HALL, D.;SHAPIRO, ANDREW |
| 分类号 |
H01P3/08;H01L23/498;H01L23/538;H01L23/64;H01P11/00;H05K1/16;H05K3/46;H05K9/00;(IPC1-7):H05K1/00;H05K1/02 |
主分类号 |
H01P3/08 |
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