Method for forming solder deposit on a substrate

摘要

An electronic circuit assembly (100) includes a circuit carrying substrate (150) on which electrical components (130) are mounted using solder deposits (125) having an essentially planar surface. A solder deposit (125) is created by forming a recess (155) in the substrate (150), providing a metallic pad (110) about the recess (155), depositing solder paste (120) on the metallic pad (110), and reflowing the solder paste (120) on the metallic pad (110). The electronic circuit (100) is assembled by placing electrical components (130) on the substrate (150) having solder deposits (125), and by further reflowing the solder deposits (125) on the metallic pad (110).