A METHOD OF ENCAPSULATING COMPONENTS ON A PRINTED CIRCUIT

摘要

Encapsulant material (30) is applied to a component on a printed circuit (12, 13) by means of a stencil, conveniently in a screen printing process, to enable a known and repeatable quantity of encapsulant material (30) to be deposited in order to minimize the thickness of the overall device. As well as the amount of material deposited a gasket (16) on the substrate (12) of the printed circuit can be used to control the spread of encapsulant on compression by a capping member for the encapsulant prior to curing.