发明名称 |
3D non-volatile memory device and method for operating and fabricating the same |
摘要 |
A 3D non-volatile memory device includes a plate-type lower select line formed over a substrate, a lower select transistor formed in the lower select line, a plurality of memory cells stacked over the lower select transistor, an upper select transistor formed over the memory cells, and a line-type common source line formed over the substrate and spaced from the lower select line. |
申请公布号 |
US9508444(B2) |
申请公布日期 |
2016.11.29 |
申请号 |
US201414281261 |
申请日期 |
2014.05.19 |
申请人 |
SK Hynix Inc. |
发明人 |
Yoo Hyun-Seung;Choi Eun-Seok;Kim Se-Jun |
分类号 |
G11C16/26;G11C16/04;G11C16/10;H01L27/115 |
主分类号 |
G11C16/26 |
代理机构 |
IP & T Group LLP |
代理人 |
IP & T Group LLP |
主权项 |
1. A read method of a 3D non-volatile memory device,
wherein the 3D non-volatile memory device comprises:
a plate-type lower select line formed over a substrate and having a first conductive type and a lower select transistor buried in the lower select line;a device isolation layer formed in the substrate; anda line-type contact plug formed over the lower select line, wherein the read method comprises:
grounding a line-type common source line which is formed over the substrate so as to be spaced from the lower select line and has the first conductive type;grounding a well area which is formed in the substrate between the lower select transistor and the common source line and has a second conductive type different from the first conductive type; andactivating the lower select line depending on a read operation of a corresponding string, wherein the common source line is formed to be contacted with the device isolation layer and horizontally spaced from the lower select line, and wherein the line-type contact plug is formed in parallel with the common source line. |
地址 |
Gyeonggi-do KR |