发明名称 Metallised rigid organic foam support for hyperfrequency electronic circuits or antenna arrays
摘要 Metallised support has a rigid expanded foam organic material, e.g. a polymethacrylate imide or vinyl polymer, support (1) covered partially with a thermoplastic organic polymer, pref. a copolymer of propylene and methylpentene, film (3) covered with a metal, e.g. copper, aluminium or alloys, layer (5). An electronically conductive convection (6) passes through the foam or films to connect the separate metallised surfaces. Also claimed is the prodn. by: activating the surface of the thermoplastic material; placing the activated surface against the support foam; placing a metal layer on the other activated surface of the thermoplastic; joining the assembly under heat and pressure.
申请公布号 FR2713139(A1) 申请公布日期 1995.06.09
申请号 FR19930014538 申请日期 1993.12.03
申请人 DEMEURE LOIC;GARNIER YVONNE;LEROUX YVON;LE ROUX YVON 发明人 DEMEURE LOIC;GARNIER YVONNE;LE ROUX YVON
分类号 B32B5/18;H05K1/02;H05K1/03;H05K3/46;(IPC1-7):B32B27/08;B32B27/30;B32B27/32;B32B31/20;H01P3/00;H01P11/00;H01Q13/26;H05K3/38 主分类号 B32B5/18
代理机构 代理人
主权项
地址