| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinder which inhibits brittle mode grinding to stably grind a wafer.SOLUTION: The grinder comprises: a spindle 23 which may rotate with a grinding stone 21 attached to its lower end; linear guides 24a and 24b which support the spindle 23 so that the spindle 23 slides relative to a column 22; a spindle feed mechanism 25 which feeds the spindle 23 in a vertical direction V; and an excess pressure releasing mechanism which is disposed between the spindle feed mechanism 25 and the column 22 and suspends the spindle feed mechanism 25. The excess pressure releasing mechanism moves up the spindle feed mechanism 25 in the vertical direction V when a friction force acting on the grinding store 21 is higher than a predetermined value.SELECTED DRAWING: Figure 2 |
