Bondapparat und Verfahren

摘要

An improved means and method for bonding closely spaced parallel wires (42) for applications in electronic devices, circuits and assemblies is described herein. A wire guiding means (60,66) is provided located between a bonding wedge (40) and a releasable wire clamp (53) of a conventional wire bonder (30). The wire guide means (60,66) has a slot (68) which constrains motion of the wire (42) during bonding to a plane perpendicular to the plane of the bonding pad (18) and substantially prevents motion of the wire (42) transverse to this perpendicular plane. This prevents the bonding from introducing minute variations in the transverse displacement of the wires (42), such variations being absorbed by small variations (50, 50C) in the wire loop height.