Heated circuit assembly tester and method

摘要

An apparatus and method provides a testing process and a machine for implementing a testing process to produce failures on a heated circuit card. The apparatus and method applies a controlled, repeatable shear stress to the joints between a circuit board and its mounted components. The circuit board is heated, and one end is twisted with respect to a second end to produce stresses within the circuit board simulating those imposed on components due to thermal cycling. The apparatus may be computer controlled, for regulating the twisting of the circuit board to produce a precise twist angle during a cyclic twisting of the heated circuit board. Electrical resistance of critical joints may be monitored during the testing, and a data base compiled identifying the cycle count at which a failure occurs and location of the failure on the circuit board.