发明名称 Curable resin composition
摘要 A curable resin composition comprising: (1) a polymerizable vinyl monomer having a structure of the formula (A):Z-R-(R2O)p-R1(A)wherein Z is a (meth)acryloyl group, R1 is a phenyl group or a phenyl group having a C1-3 alkyl group, R2 is -C2H4-, -C3H6-, -CH2CH(CH3)-, -C4H8- or -C6H12-, and p is an integer of from 1 to 10 and wherein R is a direct bond, (2) a polymerizable vinyl monomer having a structure of the formula (B): <IMAGE> (B) wherein Z and R2 are as defined above, R3 is hydrogen or a C1-4 alkyl group, and q is an integer of from 0 to 8, (3) a polymerizable vinyl monomer having a structure of the formula (C):Z-O-(R2O)p-H(C)wherein Z, R2 and p are as defined above, (4) an organic peroxide, and (5) a reducing agent.
申请公布号 US5863989(A) 申请公布日期 1999.01.26
申请号 US19970840851 申请日期 1997.04.17
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 TAGUCHI, KOICHI;SUTO, HIROSHI
分类号 C08F290/06;C09J4/00;(IPC1-7):C08F299/02;C09J5/00 主分类号 C08F290/06
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