MOUNTING STRUCTURE FOR SEMICONDUCTOR CHIP,申请号JP19980160684-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	MOUNTING STRUCTURE FOR SEMICONDUCTOR CHIP
摘要
申请公布号	JPH11354579(A)	申请公布日期	1999.12.24
申请号	JP19980160684	申请日期	1998.06.09
申请人	OKI ELECTRIC IND CO LTD	发明人	KUBOTA TOMOYUKI
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

您可能感兴趣的专利

METHOD OF FORMING CURABLE EPOXY RESIN COMPOSITIONS

PREPARING PROCESS FOR MITOCIDAL COMPOSITION

ROCKET EXHAUST PLENUM FLOW CONTROL APPARATUS

CUTTING METHOD FOR SEMIDIALYTIC FILM BY MEANS OF LASER LIGHT

VESSEL COVER WITH LINER WHICH CAN PARTIALLY BE EXFOLIATED AND REMOVED

TETRAHYDROPYRAN DERIVATIVE* ITS NOVEL INTERMEDIATE* PREPARATION AND UTILIZATION THEREOF

PRODUCTION OF SEASONED SEA TANGLE FOR SUSHI

HERRING ROELIKE FOOD MADE FROM SMELT ROE

PROCESSING OF STICKY SESAMI

VARMEGJENVINNENDE OPPVARMINGSSYSTEM FOR HUS I FORBINDELSE MED EN VARMEPUMPE OG EN INNRETNING TIL DENNE

ESTER DERIVATIVE OF PPHYDROXYBENZOIC ACID P**FLUOROPHENYL ESTER

SUBSTITUTED 33PHENOXYBENZYL ESTER* AND INSECTICIDE CONTAINING SAID ESTER AS EFFECTIVE COMPONENT

PURIFICATION OF TEREPHTHALIC ACID

HALOGENOACETYLALKYLPYRENE* AND REAGENT FOR CARBOXYLIC ACID FLUOROMETRY COMPOSED THEREOF

GERMLESS PACKER

TURNING MECHANISM FOR PAGE OF BOOKLET

FILMMFORMING METHOD

PROTECTION METHOD FOR CORROSIONNPROOF LAYER

MANUFACTURE OF SYNTHETIC RESIN MOLDING