发明名称 FILM FORMING DEVICE AND FORMATION OF FILM
摘要 PROBLEM TO BE SOLVED: To provide a film forming device suppressing the quantity of reaction by- products contained in a film and capable of improving the dielectric strength or the like thereof by narrowing the jetting region of a metal-contg. gaseous starting material and increasing the jetting velocity thereof. SOLUTION: This film forming device is the one in which metal-contg. gaseous starting material and oxidizing gas are fed to a shower head part 60 disposed at the ceiling part in a treating vessel 16, and both gases are introduced into the treating vessel respectively from gaseous starting material jetting holes 68 and oxidizing gas jetting holes 70 arranged on the gas jetting face 66 at the lower face of the shower head part to form a metal-contg. film on the surface of the body W to be treated placed on the placing stand 30 in the treating vessel. In this case, the forming region of the gaseous starting material jetting holes is made smaller than the area corresponding to the upper face of the body to be treated on the placing stand to increase the jetting velocity of the metal-contg. gaseous starting material from the gaseous starting material jetting holes. In this way, the jetting region of the metal-contg. gaseous starting material is made narrow to increase the jetting velocity thereof, and the quantity of the reaction by-products contained in the film is suppressed to improve the dielectric strength or the like thereof.
申请公布号 JP2000087244(A) 申请公布日期 2000.03.28
申请号 JP19980274354 申请日期 1998.09.10
申请人 TOKYO ELECTRON LTD 发明人 SUGIURA MASAHITO;JINRIKI HIROSHI
分类号 H01L21/31;C23C16/40;C23C16/44;C23C16/455;(IPC1-7):C23C16/455 主分类号 H01L21/31
代理机构 代理人
主权项
地址