发明名称 METHOD FOR ETCHING PRINTED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To evenly quickly etch a copper-plated laminated board by immersing the board in an acidic or alkaline aqueous solution and etching the board while diaphragms provided in the solution are vibrated. SOLUTION: After a resist coating film is formed on the surface of a copper- plated laminated board 3 and the film is exposed and developed in a pattern, the exposed portions of the copper foil are etched. In etching, the board 3 is immersed in an acidic or alkaline etchant 2 kept in a bath 1 and supported by a support 4. In addition, diaphragms 5 are arranged above and below the board 3 in parallel with the board 3. The diaphragms 5 are coupled with vibration generating sources 7 through suspended arms 6. Each source 7 is composed of a motor 9 and a coupling section 9, and the motor 10 is fixed to a pedestal 10 which is suspended by means of hanging bars 11. The bars 11 are fixed to the pedestal 12 through rubber springs 13. The vibrations of the motors 8 are transmitted to the diaphragms 5 through the arms 6 and vibrate the etchant 2.
申请公布号 JP2000138440(A) 申请公布日期 2000.05.16
申请号 JP19980347730 申请日期 1998.10.30
申请人 KARENTEKKU:KK 发明人 HIRAKAWA TADASHI
分类号 H05K3/06;C23F1/08;(IPC1-7):H05K3/06 主分类号 H05K3/06
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