发明名称 DOUBLE-SIDED PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a double-sided printed-wiring board where a metal circuit is formed on both sides of a thin insulation layer, and the insulation layer at a central part has no crack or the insulation layer at an end part can not be lost. SOLUTION: In a double-sided printed-wiring board, metal circuits 4 and 4 are formed on both sides of an insulation layer 2 that is 0.03-0.1 mm thick as shown by (a). The metal circuit 4 is always formed at the same part on a surface at the opposite side of a part where the insulation layer 2 is exposed without forming any metal circuit 4 in the double-side printed-circuit board, and the metal circuit 4 is formed at least on one surface over the entire surface of the double-sided printed wiring board. Therefore, the metal circuit 4 is formed at least on one surface in any section in the thickness direction of the double- sided printed-wiring board.
申请公布号 JP2000252594(A) 申请公布日期 2000.09.14
申请号 JP19990048992 申请日期 1999.02.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KOSEKI TAKAYOSHI;AKAMATSU TOSHIYUKI;MATSUSHITA YUKIO;INADA ISATO
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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