发明名称 |
DOUBLE-SIDED PRINTED-WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided printed-wiring board where a metal circuit is formed on both sides of a thin insulation layer, and the insulation layer at a central part has no crack or the insulation layer at an end part can not be lost. SOLUTION: In a double-sided printed-wiring board, metal circuits 4 and 4 are formed on both sides of an insulation layer 2 that is 0.03-0.1 mm thick as shown by (a). The metal circuit 4 is always formed at the same part on a surface at the opposite side of a part where the insulation layer 2 is exposed without forming any metal circuit 4 in the double-side printed-circuit board, and the metal circuit 4 is formed at least on one surface over the entire surface of the double-sided printed wiring board. Therefore, the metal circuit 4 is formed at least on one surface in any section in the thickness direction of the double- sided printed-wiring board.
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申请公布号 |
JP2000252594(A) |
申请公布日期 |
2000.09.14 |
申请号 |
JP19990048992 |
申请日期 |
1999.02.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
KOSEKI TAKAYOSHI;AKAMATSU TOSHIYUKI;MATSUSHITA YUKIO;INADA ISATO |
分类号 |
H05K1/02;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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