LOW-TEMPERATURE RAPID-CURING POLYAMIC ACID RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition which can be satisfactorily applied without cissing and can be cured at a low temperature within a short time into a shrinkage-free cured film by including a polyamic acid resin having a specified structure with a mixed solvent containing a compound having a specified structure and an aprotic polar solvent in a specified ratio. SOLUTION: This composition comprises (A) a polyamic acid resin represented by formula I and a mixed solvent containing 5-50 wt.% (B) compound represented by formula II and 95-50 wt.% aprotic polar solvent (e.g. N-methyl-2-pyrrolidone) and is desirably in the form a resin solution having a solid matter concentration of 3-50 wt.%. Component B is exemplified by propylene glycol 1-monomethyl ether 2-acetate or propylene glycol 1-ethyl ether 2-acetate. In the formulae, X is a tetravalent organic group containing an aromatic ring or an aliphatic ring; n is 1-300; Y is a divalent organic group represented by formula III (wherein R1 is a 3-9C divalent organic group; R2 and R3 are each a 1-8C monovalent hydrocarbon group; and m is 1-100); and R4 to R6 are each a monovalent hydrocarbon group.