发明名称 LAPPING APPARATUS FOR THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To perform lapping on a plane for forming a protective film or on the protective film efficiently moving a pallet holding a thermal head and carrying the thermal head to a predetermined machining position and pressing a traveling lapping material against the thermal head carried to the machining position. SOLUTION: A pallet 32 mounting a thermal head 10 is loaded at a predetermined position corresponding to a first polishing section 34a. After the traveling speed of a tape T set by a traveling means 38 is confirmed to be equal to a predetermined value, the pallet 32 is carried orthogonally to the traveling direction of the tape T while aligning the extending direction of the glaze in the head 10 with the carrying direction and passed under a press means 36 to a predetermined position. When the pallet 32 is carried, the head 10 passed through the machining position at the polishing section 34a and when the pallet 32 is carried to the predetermined position, the press means 36 descends to press the traveling tape T against the glaze in the head 10 which is thereby polished, while being carried in a predetermined direction, by means of the tape T.
申请公布号 JP2000272157(A) 申请公布日期 2000.10.03
申请号 JP19990083915 申请日期 1999.03.26
申请人 FUJI PHOTO FILM CO LTD 发明人 KASHIWATANI MAKOTO;NAKADA JUNJI
分类号 B24B19/26;B24B21/00;B24B27/00;B41J2/335;(IPC1-7):B41J2/335 主分类号 B24B19/26
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