A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.
申请公布号
EP0842534(A1)
申请公布日期
1998.05.20
申请号
EP19960923496
申请日期
1996.06.28
申请人
MINNESOTA MINING AND MANUFACTURING COMPANY
发明人
SCHUELLER, RANDOLPH, D.;PLEPYS, ANTHONY, R.;EVANS, HOWARD, E.