| 摘要 |
PROBLEM TO BE SOLVED: To make allowable adhesion of such dust that deteriorates the flatness of samples placed on a stage. SOLUTION: In a method for exposing semiconductor, the semiconductor is exposed while the height of the exposing position is controlled by measuring the surface height of a flat sample 1 fixed on the surface of a stage 2. At the time of successively exposing a plurality of flat samples 1, a measuring step of measuring the surface heights of the samples by changing the measuring position 5 for at least part of each sample; a distribution calculating step of calculating the surface height distribution of the stage 2 from the height measured results at measuring positions, the number of which is larger than that of the height measuring positions for one flat sample by accumulating surface measured results of a plurality of samples 1 at different positions; and a height distribution managing process of managing the height distribution of the samples based on the surface height distribution of the stage 2; are performed.
|
