| 摘要 |
A method and apparatus is provided for monitoring and controlling the temperature at the heat producing portion of an electrical current carrying device without direct measurement at the heat producing site. An integrated circuit 22 is thermally attached to a plurality of heat dissipating paths; top side heat conduction path 24, bottom side heat conduction path 26, and board level heat conduction path 28. On one of the heat conduction paths exists a heat flow sensor. This sensor is comprised of an inner thermistor 32 and an outer thermistor 34. The measured heat flow is combined with a single point temperature measurement and the thermal conductivity between the heat source and the temperature measurement point to produce the temperature at the heat source. This temperature is monitored in order to keep the temperature of the electrical current carrying device below critical levels or within a specified range.
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