| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device manufacturing apparatus, which is capable of protecting a semiconductor device against contamination and shortening the time required for carrying out a manufacturing process. SOLUTION: A laser irradiation device and a CVD film forming apparatus are connected to a common chamber equipped with a robot arm, and furthermore, a multi-chamber type device connected to a loading/unloading chamber is used to load cassettes where substrates are housed into the common chamber. In a state where cassettes are housed in the loading/unloading chamber, substrates can be introduced into the device, and the processed substrates can be taken out of the device in the state as they are kept in the cassettes.
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