发明名称 Tungsten-copper composite powder
摘要 <p>A high performance W-Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungstencoated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry. <IMAGE></p>
申请公布号 EP1118403(A2) 申请公布日期 2001.07.25
申请号 EP20010105153 申请日期 1996.11.15
申请人 OSRAM SYLVANIA INC. 发明人 DORFMAN, LEONID P.;SCHEITHAUER, MICHAEL J.;HOUCK, DAVID L.;PALIWAL, MUKTESH;MEYERS, GAIL T.;VENSKYTIS, FRANK J.
分类号 B22F1/00;B22F1/02;B22F9/22;C01G41/00;C04B41/51;C04B41/88;C22C1/04;H01H1/025;H01L23/498;H05K1/09;(IPC1-7):B22F1/02 主分类号 B22F1/00
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