| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film for a surface mounted area array package that can maintain a thickness of a film so as to provide a sufficient handling performance for use of the surface mounted area array package, reduce effectively popcorn phenomenon of a polyimide film in mounting a chip, and has low water absorptivity and high-water vapor permeability, and is made of the same material having a high thermal expansion coefficient and excellent elastic modulus as metal. SOLUTION: This polyimide film for the surface mounted area array package is characterized by a water absorptivity of not more than 2.2% and water vapor transmittance of not less than 1.5 g/(m2.24 h).
|
