| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for bonding plastic package with heat sink by which a plastic package divided into individual pieces can be bonded efficiently to a heat sink with positional accuracy by preventing the displaced bonding between the heat sink and plastic package. SOLUTION: The method for bonding plastic package includes a first step of placing a heat sink 18 on another heat sink 15 placed on a counter 14 by putting guide holes 23, 24, and 25 made through a frame 19 on a plurality of guide pins 16 erected on the heat sink 15, a second step of placing a positioning jig 20 on the heat sink 18 by putting the guide holes 26, 27, and 28 of the jig 20 on the guide pins 16, and a third step of placing the plastic package 17 on the opening 21 of the jig 20.
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