发明名称 |
CHIP TYPE ELECTRONIC COMPONENT SEPARATING, WASHING AND DRYING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To continuously and efficiently perform the operation of transferring a chip component and a medium from a barrel to a different container, then separating the chip component and the medium while continuously and linearly carrying the container and washing and drying the chip component. SOLUTION: This device is provided with the container 10 provided with a mesh pot for housing the chip type electronic component and the medium, carrying chains 7A and 7B for carrying the container in a fixed direction and a medium separation part 30 for separating the medium inside the container, an ultrasonic washing part 40 for ultrasonically washing the chip type electronic component inside the container, a pure water rinsing part 50 for rinsing the chip type electronic component inside the container with pure water, and a drying part 60 for drying the chip type electronic component inside the container successively in the direction of carrying the container on the carrying chains 7A and 7B.
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申请公布号 |
JP2002045802(A) |
申请公布日期 |
2002.02.12 |
申请号 |
JP20000239497 |
申请日期 |
2000.08.08 |
申请人 |
TDK CORP;IMAIZUMI TEKKOSHO:KK |
发明人 |
MORI KANEO;ONODERA AKIRA;SAKURAI TAKASHI;HIRAKAWA YOSHIHIRO |
分类号 |
B08B3/02;B08B3/12;C23G3/00;C25D17/00;F26B21/00;(IPC1-7):B08B3/02 |
主分类号 |
B08B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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