METHOD FOR FABRICATING SENSOR DEVICE

摘要

PURPOSE: A method for fabricating a sensor device is provided to simplify a fabricating process, by making a hole having a diameter of 0.5 millimeter in a substrate and by making a joint in the center of a package pin inserted to the hole so that the substrate is directly connected to the package pin without a noble metal wire. CONSTITUTION: The hole is formed in the substrate to electrically and directly connect the substrate with the package pin while a welding process is not performed regarding a connection wire. When the substrate is inserted to the package pin, a knot is formed in the center of the pin to support the substrate so that the substrate floats in the air.